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FABRICATION NOTES (UNLESS OTHERWISE SPECIFIED)
1) FABRICATE PER IPC-6012A CLASS 2.
2) OUTLINE DEFINED IN SEPARATE GERBER FILE WITH
"Edge_Cuts.GBR" SUFFIX.
DIMENSIONS OF CIRCUMSIZED RECTANGLE SHOWN ON THIS
DRAWING FOR REFERENCE ONLY.
3) SEE SEPARATE DRILL FILES WITH ".DRL" SUFFIX
FOR HOLE LOCATIONS.
SELECTED HOLE LOCATIONS SHOWN ON THIS DRAWING
FOR REFERENCE ONLY.
4) SURFACE FINISH: ${pcb_finish_cap}
5) SOLDERMASK ON BOTH SIDES OF THE BOARD SHALL
BE LPI, COLOR ${solder_mask_color_text_cap}.
6) SILK SCREEN LEGEND TO BE APPLIED PER LAYER
STACKUP USING ${silk_screen_color_text_cap} NON-CONDUCTIVE EPOXY INK.
7) ALL VIAS ARE TENTED ON BOTH SIDES UNLESS
SOLDERMASK OPENED IN GERBER.
8) VENDOR SHOULD FOLLOW ROHS COMPLIANT PROCESS
AND Pb FREE FOR MANUFACTURING
9) PCB MATERIAL REQUIREMENTS:
A. FLAMMABILITY RATING MUST MEET OR EXCEED
UL94V-0 REQUIREMENTS.
B. Tg 170 C OR EQUIVALENT.
C. EQUIVALENT MATERIAL SHALL BE RoHS COMPLIANT,
HALOGEN FREE AND APPROVED BY ${COMPANY_cap}.
10) DESIGN GEOMETRY MINIMUM FEATURE SIZES:
BOARD SIZE ${bb_w_mm} × ${bb_h_mm} mm
BOARD THICKNESS ${thickness_mm} mm
TRACE WIDTH ${track_mm} mm
TRACE TO TRACE ${clearance_mm} mm
MIN. HOLE (PTH) ${drill_pth_real_mm} mm
MIN. HOLE (NPTH) ${drill_npth_real_mm} mm
ANNULAR RING ${oar_mm} mm
COPPER TO HOLE ${c2h_mm} mm
COPPER TO EDGE ${c2e_mm} mm
HOLE TO HOLE ${h2h_mm} mm
#?stackup and impedance_controlled
#?stackup and impedance_controlled
11) REFER TO IMPEDANCE TABLE FOR IMPEDANCE CONTROL REQUIREMENTS.
#?stackup and impedance_controlled
#?stackup and impedance_controlled
12) CONFIRM SPACE WIDTHS AND SPACINGS.