FABRICATION NOTES (UNLESS OTHERWISE SPECIFIED)

1)	FABRICATE PER IPC-6012A CLASS 2.

2)	OUTLINE DEFINED IN SEPARATE GERBER FILE WITH
	"Edge_Cuts.GBR" SUFFIX.

	DIMENSIONS OF CIRCUMSIZED RECTANGLE SHOWN ON THIS
	DRAWING FOR REFERENCE ONLY.

3)	SEE SEPARATE DRILL FILES WITH ".DRL" SUFFIX 
	FOR HOLE LOCATIONS.

	SELECTED HOLE LOCATIONS SHOWN ON THIS DRAWING 
	FOR REFERENCE ONLY.

4)	SURFACE FINISH: ${pcb_finish_cap}

5)	SOLDERMASK ON BOTH SIDES OF THE BOARD SHALL 
	BE LPI, COLOR ${solder_mask_color_text_cap}.

6)	SILK SCREEN LEGEND TO BE APPLIED PER LAYER 
	STACKUP USING ${silk_screen_color_text_cap} NON-CONDUCTIVE EPOXY INK.

7)	ALL VIAS ARE TENTED ON BOTH SIDES UNLESS 
	SOLDERMASK OPENED IN GERBER.

8)	VENDOR SHOULD FOLLOW ROHS COMPLIANT PROCESS 
	AND Pb FREE FOR MANUFACTURING

9)	PCB MATERIAL REQUIREMENTS:

	A.	FLAMMABILITY RATING MUST MEET OR EXCEED 
		UL94V-0 REQUIREMENTS.
	B.	Tg 170 C OR EQUIVALENT.
	C.	EQUIVALENT MATERIAL SHALL BE RoHS COMPLIANT, 
		HALOGEN FREE AND APPROVED BY ${COMPANY_cap}.

10)	DESIGN GEOMETRY MINIMUM FEATURE SIZES:

	BOARD SIZE				${bb_w_mm} × ${bb_h_mm} mm
	BOARD THICKNESS		${thickness_mm} mm
	TRACE WIDTH			${track_mm} mm
	TRACE TO TRACE		${clearance_mm} mm
	MIN. HOLE (PTH)			${drill_pth_real_mm} mm
	MIN. HOLE (NPTH)		${drill_npth_real_mm} mm
	ANNULAR RING			${oar_mm} mm
	COPPER TO HOLE		${c2h_mm} mm
	COPPER TO EDGE		${c2e_mm} mm
	HOLE TO HOLE			${h2h_mm} mm
#?stackup and impedance_controlled

#?stackup and impedance_controlled
11)	REFER TO IMPEDANCE TABLE FOR IMPEDANCE CONTROL REQUIREMENTS.
#?stackup and impedance_controlled

#?stackup and impedance_controlled
12)	CONFIRM SPACE WIDTHS AND SPACINGS.